RCT i-BlackTex
THE FIRST INLINE & COST EFFECTIVE SOLUTION FOR
BLACK SILICON TEXTURING OF DWS WAFERS
RCT i-BlackTex technology joins the whole process of state-of-the-art Black Silicon by inline MCCE in one single tool.
RCT Solutions offers 3 different versions of the innovative and cost-effective RCT i-BlackTex technology.
RCT i-BlackTex
The All in One tool
- From DWS wafer as cut to textured wafer ready for diffusion in one tool
- <12m length @ 4,000 uph throughput
RCT i-BlackUpgrade direct-attach
The RCT Black-Silicon upgrade tool allows upgrading existing texturization tools to state-of-the-art MCCE for DWS wafers
- From DWS wafer as cut to nanostructured, Ag cleaned wafers (wet)
- For direct attachment to existing texturing tool
- <6m length @ 4,000 uph throughput
RCT i-BlackUpgrade stand-alone
If space in front of the texturization tool is not sufficient (or 8 /10 lane tool is used), a stand-alone upgrade tool is available
- From DWS wafer as cut to nanostructured, Ag cleaned wafers (dry)
- For installation anywhere in the cleanroom if space is a constraint
- <6m length @ 4,000 uph throughput
ADVANTAGES
- The whole process of state-of-the-art Black Silicon by inline MCCE in one single tool
- Inline Processing at less than 12m length (up to 4,200 uph throughput)
- Best in industry COO: 50% less cost compared to batch MCCE
- No additves required
- Stable process
- Bath lifetime >500,000 wafers
- RCT i-Black Upgrade available: upgrades existing texturing tools to Black Silicon processing
best in class
Lowest COO in industry. RCT i-BlackTex costs 1/2 of batch-type MCCE
max. module power
Max. module power guaranteed by high Voc and FF
inline and universal
RCT i-BlackTex allows for inline production of Black Silicon. Only one tool is needed
upgrade tool
Also available as upgrade tool to existing inline texuring tools