RCT i-Clean
INLINE SIO2 / PSG / BSG ETCHING AND
CLEANING FOR MULTI AND MONO SI WAFER
RCT i-Clean is a flexible cleaning tool for either immersion or single sided processing. It is suitable for etching of dielectric layers, SiO2 / PSG / BSG removal or prediffusion cleaning.
ADVANTAGES
- Optimized cost of ownership: up to 30% reduced DI water consumption and compact footprint
by integration of chiller into main module - Best in class productivity: less than one hour for bath change and unique quick-lock system
of spray bars for easy and fast maintenance - Surface near frequent chemical exchange for high-performance metal impurity cleaning
TECHNICAL DATA
| Process | Inline cleaning, single sided or immersed |
| Nominal Throughput | 3,600 wafer/h, 5 lanes |
| Conveyor Speed | 0.5 – 2.5 m/min, nominal 2.1 m/min |
| Dimensions | 8880 x 2200 x 2120 mm³ (L x W x H) |
| Wafer Size | 156 × 156±0.5mm / 156.75 × 156.75±0.25mm, ≥ 150 µm |